Dummy gate structure for electrical isolation of a fin dram

ABSTRACT

Trench capacitors can be formed between lengthwise sidewalls of semiconductor fins, and source and drain regions of access transistors are formed in the semiconductor fins. A dummy gate structure is formed between end walls of a neighboring pair of semiconductor fins, and limits the lateral extent of raised source and drain regions that are formed by selective epitaxy. The dummy gate structure prevents electrical shorts between neighboring semiconductor fins. Gate spacers can be formed around gate structures and the dummy gate structures. The dummy gate structures can be replaced with dummy replacement gate structures or dielectric material portions, or can remain the same without substitution of any material. The dummy gate structures may consist of at least one dielectric material, or may include electrically floating conductive material portions.

BACKGROUND

The present disclosure relates to a semiconductor structure, andparticularly to a dynamic random access memory (DRAM) cell including afinFET access transistor and a method of manufacturing the same.

Trench capacitors are used in a variety of semiconductor chips for highareal capacitance and low device leakage. Typically, a trench capacitorprovides a capacitance in the range from 4 fF (femto-Farad) to 120 fF. Atrench capacitor may be employed as a charge storage unit in a dynamicrandom access memory (DRAM), which may be provided as a stand-alonesemiconductor chip, or may be embedded in a system-on-chip (SoC)semiconductor chip. A trench capacitor may also be employed in a varietyof circuit applications such as a charge pump or a capacitive analogcomponent in a radio-frequency (RF) circuit.

Fin dynamic random access memory devices are typically formed in ahigh-density array configuration in order to increase the areal densityof the memory device. As the dimensions of semiconductor fins andcapacitors in a fin dynamic random access memory devices, theprobability of electrical shorts increases between a neighboring pair ofraised source and drain regions that formed by selective epitaxy of asemiconductor material.

SUMMARY

Trench capacitors can be formed between lengthwise sidewalls ofsemiconductor fins, and source and drain regions of access transistorsare formed in the semiconductor fins. A dummy gate structure is formedbetween end walls of a neighboring pair of semiconductor fins, andlimits the lateral extent of raised source and drain regions that areformed by selective epitaxy. The dummy gate structure preventselectrical shorts between neighboring semiconductor fins. Gate spacerscan be formed around gate structures and the dummy gate structures. Thedummy gate structures can be replaced with dummy replacement gatestructures or dielectric material portions, or can remain the samewithout substitution of any material. The dummy gate structures mayconsist of at least one dielectric material, or may include electricallyfloating conductive material portions.

According to an aspect of the present disclosure, a semiconductorstructure includes semiconductor fins located on a substrate. Each ofthe semiconductor fins is laterally bound by a pair of lengthwisesidewalls and a pair of widthwise sidewalls. The semiconductor structurefurther includes trench capacitors located within the substrate. Aninner electrode of each trench capacitor is electrically shorted to asource region in one of the semiconductor fins. A gate structurestraddles one of the semiconductor fins. The gate structure includes astack of a gate dielectric and a gate electrode and a gate spacerlaterally surrounding the gate dielectric and the gate electrode. Adummy gate structure including dielectric surfaces is located between awidthwise sidewall of one of the semiconductor fins and a widthwisesidewall of another of the semiconductor fins and laterally extendingalong a same direction as the gate structure.

According to another aspect of the present disclosure, a method offorming a semiconductor structure is provided. Semiconductor fins areformed on a substrate. Each of the semiconductor fins is laterally boundby a pair of lengthwise sidewalls and a pair of widthwise sidewalls.Trench capacitors are formed within the substrate. A gate structurestraddling one of the semiconductor fins is formed. The gate structureincludes a gate dielectric and a gate electrode contacting the gatedielectric. A dummy gate structure is formed between two of thesemiconductor fins. The dummy gate structure laterally extends along asame direction as the gate structure.

BRIEF DESCRIPTION OF SEVERAL VIEWS OF THE DRAWINGS

FIG. 1A is a top-down view of a first exemplary semiconductor structureafter formation of semiconductor fins in a semiconductor substrateaccording to a first embodiment of the present disclosure.

FIG. 1B is a vertical cross-sectional view of the first exemplarysemiconductor structure along the vertical plane B-B′ in FIG. 1A.

FIG. 1C is a vertical cross-sectional view of the first exemplarysemiconductor structure along the vertical plane C-C′ in FIG. 1A.

FIG. 1D is a vertical cross-sectional view of the first exemplarysemiconductor structure along the vertical plane D-D′ in FIG. 1A.

FIG. 2A is a top-down view of a first exemplary semiconductor structureafter formation of a shallow trench isolation layer according to thefirst embodiment of the present disclosure.

FIG. 2B is a vertical cross-sectional view of the first exemplarysemiconductor structure along the vertical plane B-B′ in FIG. 2A.

FIG. 2C is a vertical cross-sectional view of the first exemplarysemiconductor structure along the vertical plane C-C′ in FIG. 2A.

FIG. 2D is a vertical cross-sectional view of the first exemplarysemiconductor structure along the vertical plane D-D′ in FIG. 2A.

FIG. 3A is a top-down view of a first exemplary semiconductor structureafter formation of trenches according to the first embodiment of thepresent disclosure.

FIG. 3B is a vertical cross-sectional view of the first exemplarysemiconductor structure along the vertical plane B-B′ in FIG. 3A.

FIG. 3C is a vertical cross-sectional view of the first exemplarysemiconductor structure along the vertical plane C-C′ in FIG. 3A.

FIG. 3D is a vertical cross-sectional view of the first exemplarysemiconductor structure along the vertical plane D-D′ in FIG. 3A.

FIG. 4A is a top-down view of a first exemplary semiconductor structureafter formation of node dielectrics and inner electrodes according tothe first embodiment of the present disclosure.

FIG. 4B is a vertical cross-sectional view of the first exemplarysemiconductor structure along the vertical plane B-B′ in FIG. 4A.

FIG. 4C is a vertical cross-sectional view of the first exemplarysemiconductor structure along the vertical plane C-C′ in FIG. 4A.

FIG. 4D is a vertical cross-sectional view of the first exemplarysemiconductor structure along the vertical plane D-D′ in FIG. 4A.

FIG. 5A is a top-down view of a first exemplary semiconductor structureafter formation of trench top dielectric portions according to the firstembodiment of the present disclosure.

FIG. 5B is a vertical cross-sectional view of the first exemplarysemiconductor structure along the vertical plane B-B′ in FIG. 5A.

FIG. 5C is a vertical cross-sectional view of the first exemplarysemiconductor structure along the vertical plane C-C′ in FIG. 5A.

FIG. 5D is a vertical cross-sectional view of the first exemplarysemiconductor structure along the vertical plane D-D′ in FIG. 5A.

FIG. 6A is a top-down view of a first exemplary semiconductor structureafter recessing the shallow trench isolation layer and the trench topdielectric portions according to the first embodiment of the presentdisclosure.

FIG. 6B is a vertical cross-sectional view of the first exemplarysemiconductor structure along the vertical plane B-B′ in FIG. 6A.

FIG. 6C is a vertical cross-sectional view of the first exemplarysemiconductor structure along the vertical plane C-C′ in FIG. 6A.

FIG. 6D is a vertical cross-sectional view of the first exemplarysemiconductor structure along the vertical plane D-D′ in FIG. 6A.

FIG. 7A is a top-down view of a first exemplary semiconductor structureafter formation of disposable gate structures and dummy gate structuresaccording to the first embodiment of the present disclosure.

FIG. 7B is a vertical cross-sectional view of the first exemplarysemiconductor structure along the vertical plane B-B′ in FIG. 7A.

FIG. 7C is a vertical cross-sectional view of the first exemplarysemiconductor structure along the vertical plane C-C′ in FIG. 7A.

FIG. 7D is a vertical cross-sectional view of the first exemplarysemiconductor structure along the vertical plane D-D′ in FIG. 7A.

FIG. 7E is a vertical cross-sectional view of the first exemplarysemiconductor structure along the vertical plane E-E′ in FIG. 7A.

FIG. 8A is a top-down view of a first exemplary semiconductor structureafter formation of gate spacers and raised source and drain regionsaccording to the first embodiment of the present disclosure.

FIG. 8B is a vertical cross-sectional view of the first exemplarysemiconductor structure along the vertical plane B-B′ in FIG. 8A.

FIG. 8C is a vertical cross-sectional view of the first exemplarysemiconductor structure along the vertical plane C-C′ in FIG. 8A.

FIG. 8D is a vertical cross-sectional view of the first exemplarysemiconductor structure along the vertical plane D-D′ in FIG. 8A.

FIG. 8E is a vertical cross-sectional view of the first exemplarysemiconductor structure along the vertical plane E-E′ in FIG. 8A.

FIG. 9A is a top-down view of a first exemplary semiconductor structureafter formation of a planarization dielectric layer according to thefirst embodiment of the present disclosure.

FIG. 9B is a vertical cross-sectional view of the first exemplarysemiconductor structure along the vertical plane B-B′ in FIG. 9A.

FIG. 9C is a vertical cross-sectional view of the first exemplarysemiconductor structure along the vertical plane C-C′ in FIG. 9A.

FIG. 9D is a vertical cross-sectional view of the first exemplarysemiconductor structure along the vertical plane D-D′ in FIG. 9A.

FIG. 9E is a vertical cross-sectional view of the first exemplarysemiconductor structure along the vertical plane E-E′ in FIG. 9A.

FIG. 10A is a top-down view of a first exemplary semiconductor structureafter formation of replacement gate structures and dummy replacementgate structures according to the first embodiment of the presentdisclosure.

FIG. 10B is a vertical cross-sectional view of the first exemplarysemiconductor structure along the vertical plane B-B′ in FIG. 10A.

FIG. 10C is a vertical cross-sectional view of the first exemplarysemiconductor structure along the vertical plane C-C′ in FIG. 10A.

FIG. 10D is a vertical cross-sectional view of the first exemplarysemiconductor structure along the vertical plane D-D′ in FIG. 10A.

FIG. 10E is a vertical cross-sectional view of the first exemplarysemiconductor structure along the vertical plane E-E′ in FIG. 10A.

FIG. 11A is a top-down view of a first exemplary semiconductor structureafter formation of various conductive structures according to the firstembodiment of the present disclosure.

FIG. 11B is a vertical cross-sectional view of the first exemplarysemiconductor structure along the vertical plane B-B′ in FIG. 11A.

FIG. 11C is a vertical cross-sectional view of the first exemplarysemiconductor structure along the vertical plane C-C′ in FIG. 11A.

FIG. 11D is a vertical cross-sectional view of the first exemplarysemiconductor structure along the vertical plane D-D′ in FIG. 11A.

FIG. 11E is a vertical cross-sectional view of the first exemplarysemiconductor structure along the vertical plane E-E′ in FIG. 11A.

FIG. 12A is a top-down view of a second exemplary semiconductorstructure in which dummy gate structures are replaced with dielectricdummy gate structures according to a second embodiment of the presentdisclosure.

FIG. 12B is a vertical cross-sectional view of the second exemplarysemiconductor structure along the vertical plane B-B′ in FIG. 12A.

FIG. 12C is a vertical cross-sectional view of the second exemplarysemiconductor structure along the vertical plane C-C′ in FIG. 12A.

FIG. 12D is a vertical cross-sectional view of the second exemplarysemiconductor structure along the vertical plane D-D′ in FIG. 12A.

FIG. 12E is a vertical cross-sectional view of the second exemplarysemiconductor structure along the vertical plane E-E′ in FIG. 12A.

FIG. 13A is a top-down view of a third exemplary semiconductor structureafter masking dummy gate structures and removal of disposable gatestructures according to a third embodiment of the present disclosure.

FIG. 13B is a vertical cross-sectional view of the third exemplarysemiconductor structure along the vertical plane B-B′ in FIG. 13A.

FIG. 13C is a vertical cross-sectional view of the third exemplarysemiconductor structure along the vertical plane C-C′ in FIG. 13A.

FIG. 13D is a vertical cross-sectional view of the third exemplarysemiconductor structure along the vertical plane D-D′ in FIG. 13A.

FIG. 13E is a vertical cross-sectional view of the third exemplarysemiconductor structure along the vertical plane E-E′ in FIG. 13A.

FIG. 14A is a top-down view of a fourth exemplary semiconductorstructure after formation of replacement gate structures according to afourth embodiment of the present disclosure.

FIG. 14B is a vertical cross-sectional view of the fourth exemplarysemiconductor structure along the vertical plane B-B′ in FIG. 14A.

FIG. 14C is a vertical cross-sectional view of the fourth exemplarysemiconductor structure along the vertical plane C-C′ in FIG. 14A.

FIG. 14D is a vertical cross-sectional view of the fourth exemplarysemiconductor structure along the vertical plane D-D′ in FIG. 14A.

FIG. 14E is a vertical cross-sectional view of the fourth exemplarysemiconductor structure along the vertical plane E-E′ in FIG. 14A.

FIG. 15A is a top-down view of a variation of the first exemplarysemiconductor structure according to the first embodiment of the presentdisclosure.

FIG. 15B is a vertical cross-sectional view of the variation of thefirst exemplary semiconductor structure along the vertical plane B-B′ inFIG. 15A.

FIG. 16A is a top-down view of a variation of the second exemplarysemiconductor structure according to the first embodiment of the presentdisclosure.

FIG. 16B is a vertical cross-sectional view of the variation of thesecond exemplary semiconductor structure along the vertical plane B-B′in FIG. 16A.

FIG. 17A is a top-down view of a variation of the third exemplarysemiconductor structure according to the first embodiment of the presentdisclosure.

FIG. 17B is a vertical cross-sectional view of the variation of thethird exemplary semiconductor structure along the vertical plane B-B′ inFIG. 16A.

DETAILED DESCRIPTION

As stated above, the present disclosure relates to a dynamic randomaccess memory (DRAM) cell including a finFET access transistor and amethod of manufacturing the same. These aspects of the presentdisclosure are now described in detail with accompanying figures. It isnoted that like reference numerals refer to like elements acrossdifferent embodiments. The drawings are not necessarily drawn to scale.

Referring to FIGS. 1A-1D, a first exemplary semiconductor structureaccording to a first embodiment of the present disclosure includes asemiconductor substrate, which can be a bulk semiconductor substrate.The semiconductor substrate includes a semiconductor material, which canbe selected from elemental semiconductor materials (e.g., silicon,germanium, carbon, or alloys thereof), III-V semiconductor materials, orII-VI semiconductor materials. In one embodiment, the semiconductorsubstrate can include a single crystalline semiconductor material.

An upper portion of the semiconductor substrate can be patterned, by acombination of lithographic methods and an anisotropic etch, to form aplurality of semiconductor fins 30. The height of the semiconductor fins30 can be from 5 nm to 300 nm, although lesser and greater heights canalso be employed. The remaining portion of the semiconductor substrateunderlying the plurality of semiconductor fins 30 is herein referred toas a semiconductor material layer 10. The plurality of semiconductorfins 30 and the semiconductor material layer 10 can be doped withelectrical dopants, i.e., p-type dopants or n-type dopants, or can beintrinsic. In one embodiment, the entirety of the plurality ofsemiconductor fins 30 and the semiconductor material layer 10 can have asame type of doping, which is herein referred to as a first conductivitytype.

As used herein, a “semiconductor fin” refers to a semiconductor materialportion having a pair of parallel vertical sidewalls that are laterallyspaced by a uniform dimension. In one embodiment, each semiconductor fincan have a rectangular horizontal cross-sectional area such that thespacing between the pair of parallel vertical sidewalls is the same asthe length of shorter sides of the shape of the rectangular horizontalcross-sectional area. As used herein, a “fin field effect transistor”refers to a field effect transistor in which at least a channel regionis located within a semiconductor fin.

Each semiconductor fin 30 is laterally bound by a pair of lengthwisesidewalls and a pair of widthwise sidewalls. As used herein, a“lengthwise direction” of an element refers to a direction about whichthe moment of inertia of the element becomes a minimum. As used herein,a “lengthwise sidewall” of an element refers to a sidewall of an elementthat extends along the lengthwise direction of the element. As usedherein, a “widthwise sidewall” of an element refers to a sidewall of theelement that extends along a horizontal direction that is perpendicularto the lengthwise direction of the element. In one embodiment, each ofthe plurality of semiconductor fins 30 can have a rectangular horizontalcross-sectional shape.

In one embodiment, lengthwise sidewalls of multiple semiconductor fins30 within a same row can be within a pair of vertical planes laterallyspaced from each other by the width of a semiconductor fin 30. In oneembodiment, widthwise sidewalls of multiple semiconductors within a samecolumn can be within a pair of vertical planes laterally spaced fromeach other by the length of a semiconductor fin 30. In one embodiment,the plurality of semiconductor fins 30 can be within a two-dimensionalarray having a first pitch along the lengthwise direction of thesemiconductor fins 30 and a second pitch along the lengthwise directionof the semiconductor fins.

Referring to FIGS. 2A-2D, a shallow trench isolation layer 20 is formedamong the plurality of semiconductor fins 30. The shallow trenchisolation layer 20 includes a dielectric material such as silicon oxide.The shallow trench isolation layer 20 can be formed by depositing adielectric material over the semiconductor fins 30 and the semiconductormaterial layer 10. The deposition of the dielectric material can beperformed, for example, by chemical vapor deposition or spin coating.Excess portions of the deposited dielectric material can be removed fromabove the top surfaces of the semiconductor fins 30, for example, byplanarization (such as chemical mechanical planarization (CMP)). Theshallow trench isolation layer 30 laterally surrounds the plurality ofsemiconductor fins 30. The top surface of the shallow trench isolationlayer 30 can be coplanar with the top surfaces of the plurality ofsemiconductor fins 30.

Referring to FIGS. 3A-3D, a hard mask layer 36 can be deposited over theshallow trench isolation layer 20, for example, by chemical vapordeposition (CVD). The hard mask layer 36 can include one or more layersthat can be employed as an etch mask for forming trenches 11 in thesemiconductor material layer 10. In one embodiment, the hard mask layer36 can include a dielectric material such as a doped or undoped siliconoxide, silicon nitride, a dielectric metal nitride, or a dielectricmetal oxide. The thickness of the hard mask layer 36 can be from 100 nmto 2,000 nm, although lesser and greater thicknesses can also beemployed.

A photoresist layer (not shown) can be applied over the hard mask layer36, and can be lithographically patterned to form openings correspondingto the areas of trenches 11 to be subsequently formed. The pattern inthe photoresist layer can be transferred into the hard mask layer 36.Subsequently, the pattern in the hard mask layer 36 can be transferredthrough the shallow trench isolation layer 20 and an upper portion ofthe semiconductor material layer 10 by an anisotropic etch that employsthe hard mask layer 36 as an etch mask. A trench 11 can be formed foreach opening in the hard mask layer 36. The photoresist can be removedby ashing, or can be consumed during the etch process that forms thetrenches 11.

In one embodiment, the locations of the openings in the photoresistlayer and the hard mask layer 36 can be selected such that entireperiphery of each trench 11 can be formed between a first vertical planeincluding a proximal lengthwise sidewall of a first semiconductor fin 30within a neighboring pair of the semiconductor fins 30 and a secondvertical plane including a proximal lengthwise sidewall of a secondsemiconductor fin within the neighboring pair of the semiconductor fins30. Within the neighboring pair of the semiconductor fins 30, the firstsemiconductor fin and the second semiconductor fin are laterally spacedfrom each other by the widthwise direction of the semiconductor fins 30,i.e., along the horizontal direction perpendicular to the lengthwisedirection of each semiconductor fin 30. Further, the entire periphery ofeach trench 11 can be formed between a pair of vertical planes includingtwo widthwise sidewalls of the first semiconductor fin, which can alsoinclude two widthwise sidewalls of the second semiconductor fin.

The sidewalls of each trench 11 can be substantially verticallycoincident among the various layers (36, 20, 10) through which thetrench 11 extends. As used herein, sidewalls of multiple elements are“vertically coincident” if the sidewalls of the multiple elementsoverlap in a top-down view. As used herein, sidewalls of multipleelements are “substantially vertically coincident” if the lateral offsetof the sidewalls of the multiple elements from a perfectly verticalsurface is within three times the root mean square of surface roughnessof sidewalls of each element.

The depth of each trench 11 as measured from the plane of the topmostsurface of the semiconductor fins 30 to the bottom surface of the trench11 can be from 500 nm to 10 microns, although lesser and greater depthscan also be employed. In one embodiment, the trenches 11 can be deeptrenches. As used herein, a “deep trench” refers to a trench that havinga depth greater than 2.0 microns. The lateral dimensions of each trench11 can be limited by the lithographic capabilities, i.e., the ability ofa lithographic tool to print the image of an opening on the photoresistlayer.

Referring to FIGS. 4A-4D, buried plates 12 can be formed by doping aportion of the semiconductor material layer 10 in proximity of sidewallsof each trench 11. Dopants can be introduced, for example, byoutdiffusion from a dopant-including disposable material (such as adoped silicate glass) or by ion implantation as known in the art.Further, any other method of forming buried plates 12 in thesemiconductor material layer 10 can be employed in lieu of outdiffusionfrom a dopant-including disposable material or ion implantation.

In one embodiment, the buried plates 12 can be doped with dopants of asecond conductivity type, which is the opposite of the firstconductivity type. For example, the first conductivity type can bep-type and the second conductivity type can be n-type, or vice versa. Ap-n junction is formed between the remaining portion of thesemiconductor material layer 10 and the buried plates 12. The dopantconcentration in the buried plates 12 can be, for example, from1.0×10¹⁸/cm³ to 2.0×10²¹/cm³, and typically from 5.0×10¹⁸/cm³ to5.0×10¹⁹/cm³, although lesser and greater dopant concentrations can alsobe employed.

A node dielectric 42 can be deposited conformally on all physicallyexposed sidewalls in each trench 11 and on the top surface of the hardmask layer 36. The node dielectric 42 can include any dielectricmaterial that can be employed as a node dielectric material in acapacitor known in the art. For example, the node dielectric 42 caninclude at least one of silicon nitride and a dielectric metal oxidematerial such as high dielectric constant (high-k) gate dielectricmaterial as known in the art.

A conductive material can be deposited to completely fill each trench11. The conductive material can be a metallic material or a dopedsemiconductor material. The metallic material can be an elemental metalsuch as W, Ti, Ta, Cu, or Al, or an alloy of at least two elementalmetals, or a conductive metallic nitride of at least one metal, or aconductive metallic oxide of at least one metal. The doped semiconductormaterial can be a doped elemental semiconductor material, a dopedcompound semiconductor material, or an alloy thereof. The conductivematerial can be deposited by physical vapor deposition (PVD), chemicalvapor deposition (CVD), electroplating, electroless plating, or acombination thereof. The conductive material is deposited to a thicknessthat is sufficient to fill each trench 11 completely.

Excess portions of the conductive material can be removed from above thetop surface of the hard mask layer 36, for example, by chemicalmechanical planarization. Subsequently, the conductive material can bevertically recessed to a level between the top surface of the shallowtrench isolation layer 20 and the bottom surface of the shallow trenchisolation layer 20 by a recess etch. The recess etch of the conductivematerial layer can employ an anisotropic etch such as a reactive ionetch, an isotropic etch such as a wet etch, or a combination thereof.The recess etch can be selective to the material of the node dielectric42.

An inner electrode 44 including the conductive material is formed ineach trench 11. The topmost surface of the inner electrode 44 issubstantially planar, and is located between the level of the topsurface of the shallow trench isolation layer 20 and the level of thebottom surface of the shallow trench isolation layer 20. A surface issubstantially planar if the planarity of the surface is limited bymicroscopic variations in surface height that accompanies semiconductorprocessing steps known in the art. A cavity 47 is formed above the innerelectrode 44.

The physically exposed portions of the node dielectrics 42 can bepatterned by an etch, which can be a wet etch. For example, if the nodedielectrics 42 include silicon nitride, the physically exposed portionsof the node dielectric 42 can be removed by a wet etch employing hotphosphoric acid. Each remaining portion of the node dielectric 42 withineach trench 11 constitutes a node dielectric 42. Each adjoined set of aburied plate 12, a node dielectric 42, and an inner electrode 44constitute a trench capacitor (12, 42, 44). Each buried plate 12 is anouter node of the trench capacitor, the node dielectric 42 is thedielectric separating the outer electrode from the inner electrode, andthe inner electrode 44 is the inner electrode of the trench capacitor.The trench capacitor is embedded within the combination of thesemiconductor material layer 10 and the shallow trench isolation layer20. The shallow trench isolation layer 20 overlies the buried plate 12(i.e., the outer electrode).

Referring to FIGS. 5A-5D, a dielectric material can be deposited withinthe cavity 47, and can be subsequently planarized employing the hardmask layer 36 as a stopping layer to remove excess portions of thedeposited dielectric material from above the top surface of the hardmask layer 36. The remaining portion of the deposited dielectricmaterial can be recessed relative to the top surface of the hard masklayer 36 by a recess etch to a height about the top surface of theshallow trench isolation layer 20 to form a trench top dielectricportion 46 within each trench. The dielectric material of the trench topdielectric portions 46 can be different from the dielectric material ofthe hard mask layer 36. For example, the dielectric material of the hardmask layer 36 can be silicon nitride, and dielectric material of thetrench top dielectric portion 46 can be silicon oxide. The dielectricmaterial of the trench top dielectric portion 46 can be deposited, forexample, by chemical vapor deposition (CVD).

Referring to FIGS. 6A-6D, the hard mask layer 36 can be removed, forexample, by a wet etch selective to the trench top dielectric portion 46and the shallow trench isolation layer 20. In one embodiment, the hardmask layer 36 can include silicon nitride, the trench top dielectricportion 46 and the shallow trench isolation layer 20 include siliconoxide, and the removal of the hard mask layer 36 selective to the trenchtop dielectric portion 46 and the shallow trench isolation layer 20 canbe effected by a wet etch employing hot phosphoric acid.

The shallow trench isolation layer 20 and the trench top dielectricportions 46 are recessed relative to the top surfaces of thesemiconductor fins 30. An etch process that is selective to thesemiconductor material of the semiconductor fins 30 can be employed torecess the shallow trench isolation layer 20 and the trench topdielectric portions 46. For example, if the shallow trench isolationlayer 20 and the trench top dielectric portion 46 include silicon oxide,a wet etch employing hydrofluoric acid can be employed to recess theshallow trench isolation layer 20 and the trench top dielectric portions46. Surfaces of an upper portion of each semiconductor fin 30 arephysically exposed.

Referring to FIGS. 7A-7E, a stack of gate level layers can be depositedand lithographically patterned to form various gate-level structures. Asused herein, a “gate-level structure” refers to a structure that isformed at the same level as gate electrodes of field effect transistors.As such, a gate-level structure includes a surface that contacts asemiconductor fin and/or the shallow trench isolation layer 20.

The gate level layers can include, for example, a gate dielectric layer,a gate material layer, and a gate cap layer. The gate dielectric layercan be a disposable dielectric material that is removed in field effecttransistors to be formed, or can include a non-disposable dielectricmaterial that remains permanently in field effect transistors to beformed. The gate material layer can include a disposable material thatis removed in field effect transistors to be formed, or can include anon-disposable conductive material that remains permanently in fieldeffect transistors to be formed. The gate cap layer includes adielectric material such as silicon nitride or a dielectric nitride.

The gate dielectric layer can be formed by conversion of surfaceportions of a semiconductor material (e.g., the semiconductor materialof the semiconductor fins 30; See FIGS. 6A-6D), deposition of adielectric material, or a combination thereof. The gate dielectric layercan include a dielectric semiconductor-containing compound (e.g.,silicon oxide, silicon nitride, and/or silicon oxynitride) and/or adielectric metal compound (e.g., dielectric metal oxide, dielectricmetal nitride, and/or dielectric metal oxynitride).

If the gate fill layer includes a non-disposable conductive material,the gate material layer can include a doped semiconductor materialand/or a metallic material. The gate fill layer can optionally include awork function metal layer that tunes the threshold voltage of the accesstransistor to be formed.

The gate level layers can be patterned by a combination of lithographyand etch to form various gate-level structures. The gate-levelstructures include gate structures (50, 52, 58) that straddlesemiconductor fins 30 without contacting widthwise sidewalls of thesemiconductor fins 30, and dummy gate structures that contact widthwisesidewalls of the semiconductor fins 30 or passes through a space betweena neighboring pair of widthwise sidewalls of semiconductor fins 30. Asused herein, a “gate structure” refers to a gate-level structure thatstraddles and contacts a body region of at least one field effecttransistor. As used herein, a “dummy gate structure” refers to agate-level structure that does not straddle a body region of any fieldeffect transistor.

Each remaining portion of the gate dielectric layer within a gatestructure (50, 52, 58) constitutes a gate dielectric 50, and eachremaining portion of the gate dielectric layer within a dummy gatestructure (51, 53, 39) constitutes a dummy gate dielectric 51. Eachremaining portion of the gate fill layer within a gate structure (50,52, 58) constitutes a gate fill structure 52, and each remaining portionof the gate fill layer within a dummy gate structure (51, 53, 39)constitutes a dummy gate fill structure 53. Each remaining portion ofthe gate cap layer within a gate structure (50, 52, 58) constitutes agate cap dielectric 58, and each remaining portion of the gate cap layerwithin a dummy gate structure (51, 53, 39) constitutes a dummy gate cap59. In one embodiment, the entirety of the widthwise sidewalls of thesemiconductor fins 30 can be in contact with a surface of a dummy gatedielectric 50.

Portions of the semiconductor fins 30 that underlie the gate structures(50, 52, 58) correspond to the body regions of access field effecttransistors to be subsequently formed for the trench capacitors (12, 42,44). The gate structures (50, 52, 58) and the dummy gate structures (51,53, 59) can extend along the general direction of the widthwisedirection of the plurality of semiconductor fins 30. The dummy gatestructures (51, 53, 59) are formed between pairs of neighboringsemiconductor fins 30 that are positioned along the lengthwise directionof the semiconductor fins 30 with respect to each other. The dummy gatestructures (51, 53, 59) are formed concurrently with formation of thegate structures (50, 52, 58). While the present disclosure is describedemploying gate structures (50, 52, 58) and the dummy gate structures(51, 53, 59) extending along the direction perpendicular to thelengthwise direction of the semiconductor fins 30, embodiments in whichwiggles are introduced within the gate structures (50, 52, 58) and thedummy gate structures (51, 53, 59) are expressly contemplated herein.

In one embodiment, the gate structures (50, 52, 58) are disposable gatestructures that are subsequently replaced with other gate structures,which are herein referred to as replacement gate structures. In thiscase, the disposable gate structures include disposable materials, whichare herein referred to as disposable gate materials, i.e., disposablematerials formed within gate-level structures.

In one embodiment, the gate structures (50, 52, 58) are permanent gatestructures that are present in field effect transistors and function asa combination of a gate dielectric and a gate electrode. In this case,the gate dielectric can include any gate dielectric material that can beemployed in gate-first integration schemes, i.e., non-replacement gateintegration schemes. Each gate fill structure 52 includes a conductivematerial, and constitutes a gate electrode that is functional, i.e.,capable of turning on or off field effect transistors. In this case, thedummy gate structures (51, 53, 59) may, or may not, be subsequentlyreplaced.

In one embodiment, independent of whether the gate structures (50,52,58) are disposable gate structures or permanent gate structures, thedummy gate structures (51, 53, 59) can be disposable dummy gatestructures that are subsequently replaced with other gate structures,which are herein referred to as replacement dummy gate structures. Inthis case, the disposable dummy gate structures include disposablematerials, which are herein referred to as disposable gate materials,i.e., disposable materials formed within gate-level structures.

In another embodiment, independent of whether the gate structures(50,52, 58) are disposable gate structures or permanent gate structures,the dummy gate structures (51, 53, 59) can be permanent dummy gatestructures that are present in field effect transistors during operationin a semiconductor chip. In this case, the dummy gate fill structure 53may include a conductive material or a dielectric material. In thiscase, the gate structures (50, 52, 58) may, or may not, be subsequentlyreplaced.

Source regions 3S and drain regions 3D can be formed by implantingdopants of the opposite conductivity type of the first conductivitytype. The gate structures (50, 52, 58) and the dummy gate structures(51, 53, 59) can be employed as mask structures during the ionimplantation that forms the source regions 3S and the drain regions 3D.Unimplanted portions of the semiconductor fins 30 constitute bodyregions 3B.

Referring to FIGS. 8A-8E, gate spacers 56 and dummy gate spacers 59 canbe simultaneously formed by depositing a conformal dielectric layer andanisotropically etching the conformal dielectric layer. In oneembodiment, the conformal dielectric layer can include a dielectricmaterial different from the dielectric material of the shallow trenchisolation layer 20. For example, the conformal dielectric layer caninclude silicon nitride. The etch process that removes horizontalportions of the conformal dielectric layer can be prolonged afterhorizontal portions of the conformal dielectric layer are removed sothat vertical portions of the conformal dielectric layer on sidewalls ofthe semiconductor fins (3S, 3D, 3B) are removed.

Each remaining portion of the conformal dielectric layer around a gatestructure (50, 52, 58) is a gate spacer 56. Each remaining portion ofthe conformal dielectric layer around a dummy gate structure (51, 53,59) is a dummy gate spacer 59, i.e., a gate spacer formed on a dummygate structure (52, 53, 59). Each gate spacer 56 laterally surrounds agate structure (50, 52, 58), and each dummy gate spacer 59 laterallysurrounds a dummy gate structure (51, 53, 59). The gate spacers 56 donot contact any widthwise sidewall of the semiconductor fins (3S, 3D,3B), and the dummy gate spacers 59 contact end portions of the sourceand drain regions (3S, 3D) of the semiconductor fins.

Optionally, dopants of the second conductivity type can be implantedinto the source regions 3S and the drain regions 3D of the semiconductorfins (3S, 3D, 3B) employing the combination of the gate structures (50,52, 58), the dummy gate structures (51, 53, 59), the gate spacers 56,and the dummy gate spacers 59 as an implantation mask.

Optionally, a selective epitaxy process can be performed to deposit asemiconductor material on physically exposed semiconductor surfaces. Araised source region 4S can be formed directly on each source region 3S,and a raised drain region 4D can be formed directly on each drain region3D. Each raised source region 4S is epitaxially aligned to an underlyingsource region 3S. Each raised drain region 4D is epitaxially aligned toan underlying drain region 3D. The extent of each raised source region4S is limited by a sidewall of a gate spacer 56 and a sidewall of adummy gate spacer 59. The extent of each raised drain region 4D can belimited by sidewalls of a pair of gate spacers 56. The lateral extent ofthe raised source regions 4S and the raised drain regions 4D iscontrolled to avoid electrical shorts thereamongst. The outer sidewallssurfaces of the raised source regions 4S and the raised drain regions 4Dmay contact the shallow trench isolation layer 20 only, or may contacttop surfaces of the trench top dielectric portions 46, depending on thethickness of the raised source regions 4S and the raised drain region4D.

Referring to FIGS. 9A-9E, a planarization dielectric layer 80 is formedover the plurality of semiconductor fins (3S, 3D, 3B), the gatestructures (50, 52, 58), and the dummy gate structures (51, 53, 59). Theplanarization dielectric layer 80 can be formed, for example, by spin-oncoating or chemical vapor deposition (CVD) of a dielectric material. Theplanarization dielectric layer 80 may include a single dielectricmaterial layer, or may include a plurality of dielectric materiallayers. Excess portions of the deposited dielectric material layer canbe removed from above the horizontal plane including the top surface ofthe gate fill structures 52 and the dummy gate fill structures 53, forexample, by chemical mechanical planarization.

In one embodiment, the gate structures (50, 52) can be electricallyconnected to suitable contact structures (not shown) to becomefunctional gate structures. As used herein, a “functional gatestructure” refers to a gate structure that includes a stack of a gatedielectric and a conductive structure in which the gate dielectriccontacts a body region of a field effect transistor and the conductivestructure functions as a gate electrode to which electrical voltages canbe applied to turn on and to turn off the field effect transistor. Asused herein, a “functional gate dielectric” is a gate dielectric withina functional gate structure. As used herein, a “functional gateelectrode” is a gate electrode within a functional gate structure. Inone embodiment, each gate dielectric 50 can be a functional gatedielectric and each gate fill structure 52 can be a functional gateelectrode.

In one embodiment, metal interconnect structures including a pluralityof dielectric layers, metal lines, and metal via structures can beformed above the top surface of the planarization dielectric layer. Inthis case, the gate structures (50, 52) can be functional gatestructures, and the dummy gate structures (51, 53) can be electricallyfloating. In one embodiment, all surfaces of the dummy gate fillers 53can contact dielectric surfaces. For example, each dummy gate filler 53can be encapsulated by a dummy gate dielectric 51, a dummy gate spacer59, and a dielectric material layer (not shown) that is subsequentlyformed on the top surface of the planarization dielectric layer. As usedherein, an element is encapsulated by a set of elements if the entirevolume of the element is within a volume defined by inner surfaces ofthe set of elements.

In one embodiment, dielectric surfaces of each dummy gate structure (51,53) can contact widthwise sidewalls of a neighboring pair ofsemiconductor fins (3S, 3D, 3B) that are laterally spaced from eachother along a lengthwise direction of the semiconductor fins (3S, 3D,3B).

Referring to FIGS. 10A-10E, the gate structures (50, 52) and the dummygate structures (51, 53) may be replaced with different gate structuresand different dummy gate structures prior to forming any metalinterconnect structure above the planarization dielectric layer. In thisembodiment, the gate structures (50, 52) are disposable gate structures,and the dummy gate structures (51, 53) are disposable dummy gatestructures. The different gate structure and the different dummy gatestructure are herein referred to as replacement gate structures (70, 72)and replacement dummy gate structures (71, 73), respectively. Areplacement gate structure (70, 72) is a functional gate structure, anda dummy replacement gate structure (71, 73) is a non-functional gatestructure, i.e. a gate structure that is not a functional gatestructure.

The removal of the gate structures (50, 52) and the dummy gatestructures (51, 53) can be performed employing at least one etch that isselective to the dielectric material of the planarization dielectriclayer 80. Formation of the replacement gate structures (70, 72) and thedummy replacement gate structures (71, 73) can be formed by depositing agate dielectric layer and a conductive material layer, and removingexcess portions of the gate dielectric layer and the conductive materiallayer from above the top surface of the planarization dielectric layer80, for example, by chemical mechanical planarization (CMP).

Each remaining portion of the gate dielectric layer filling a cavityformed by removal of a gate structure (50, 52) constitutes a gatedielectric, which is herein referred to as a replacement gate dielectric70. Each remaining portion of the conductive material layer filling acavity formed by removal of a gate structure (50, 52) constitutes a gateelectrode 72. Each remaining portion of the gate dielectric layerfilling a cavity formed by removal of a dummy gate structure (51, 53)constitutes a dielectric liner 71, which has the same composition as thegate dielectrics 70 and is a component of a non-functional gatestructure. Each remaining portion of the conductive material layerfilling a cavity formed by removal of a dummy gate structure (51, 53)constitutes a conductive material portion 73, which is a fill structurefor a non-functional gate structure. The conductive material portion 73has the same composition as the gate electrode 72.

Each replacement gate structure (70, 72) is a functional gate structurethat straddles at least one semiconductor fin 30 and at least one trenchcapacitor (12, 42, 44). Each replacement gate structure (70, 72)includes a replacement gate dielectric 70 and a gate electrode 72. Thereplacement dummy gate structures (71, 73) are non-functional gatestructures, and extends along the same direction as the replacement gatestructures (70, 72), i.e., along the general direction perpendicular tothe lengthwise direction of the semiconductor fins (3S, 3D, 3B).

Referring to FIGS. 11A-11E, various conductive structures (82, 84) areformed through the planarization dielectric layer, for example, byformation of via cavities and filling of the via cavities with aconductive material. Formation of the via cavities can be performed byapplication of a photoresist layer (not shown) above the planarizationdielectric layer 80, lithographic patterning of the photoresist layer,and transfer of the pattern in the photoresist layer into theplanarization dielectric layer 80 by an anisotropic etch such as areactive ion etch. The via cavities can be filled with the conductivematerial by chemical vapor deposition or physical vapor deposition, andexcess portions of the conductive material can be removed from above thetop surface of the planarization dielectric layer 80 by chemicalmechanical planarization.

The various conductive structures (82, 84) can include contact viastructures 84 that contact the raised drain regions 4D and/or the drainregions 3D. Further, the various conductive structures (82, 84) caninclude conductive strap structures 82. Each conductive strap structure82 can electrically short a source region 3S in the one of thesemiconductor fins (3S, 3D, 3B) and an inner electrode 44 in one of thetrench capacitors (12, 42, 44). Each conductive strap structure 82 canbe formed as a self-aligned structure laterally bounded by a gate spacer56 and a dummy gate spacer 59. Thus, sidewalls of each conductive strapstructure 82 can contact a gate spacer 56 and a dummy gate spacer 59.

The first exemplary semiconductor structure includes semiconductor fins(3S, 3D, 3B) located on a substrate (which includes the semiconductormaterial layer 10 and the buried plates 12). Each of the semiconductorfins (3S, 3D, 3B) is laterally bound by a pair of lengthwise sidewallsand a pair of widthwise sidewalls. The first exemplary semiconductorstructure further includes trench capacitors (12, 42, 44) located withinthe substrate. An inner electrode 44 of each trench capacitor (12, 42,44) is electrically shorted to a source region 3S in one of thesemiconductor fins (3S, 3D, 3B).

Each replacement gate structure (70, 72) straddles one of thesemiconductor fins (3S, 3D, 3B), and includes a stack of a gatedielectric, i.e., a replacement gate dielectric 70, and a gate electrode72. A gate spacer 56 laterally surrounding the replacement gatedielectric 70 and the gate electrode 72. Each replacement dummy gatestructure (71, 73) includes dielectric surfaces located between awidthwise sidewall of one of the semiconductor fins (3S, 3D, 3B) and awidthwise sidewall of another of the semiconductor fins (3S, 3D, 3B).The replacement dummy gate structures (71, 73) can laterally extendalong the same direction as the replacement gate structures (70, 72).Each dummy gate spacer 59 laterally surrounds a replacement dummy gatestructure (71, 73), and has the same composition and lateral thicknessas the gate spacers 56. The shallow trench isolation layer 20 is incontact with the bottom surface of the replacement dummy gate structures(71, 73).

Referring to FIGS. 12A-12E, a second exemplary semiconductor structureaccording to a second embodiment of the present disclosure can bederived from the first exemplary semiconductor structure of FIGS.10A-10E or FIGS. 11A-11E by replacing the replacement dummy gatestructures (71, 73) with different dummy gate structures 173. Each dummygate structure 173 is a dielectric material portion, which replaces acombination of a dielectric liner 71 and a conductive material portion73.

The replacement dummy gate structures (71, 73; See FIGS. 11A-11E) can beremoved by masking the replacement gate structures (70, 72) with amasking layer, etching the conductive material portions 73 with anetchant that is selective to the planarization dielectric layer 80 andthe dielectric material of the disposable gate spacers 59. Thedielectric liners 71 may, or may not, be removed. A dielectric materialcan be deposited into cavities from which the conductive materialportions 73 are removed. Excess portions of the deposited dielectricmaterial can be removed from above the top surface of the planarizationdielectric layer 80 to form the dummy gate structures 173. If thedielectric liners 71 are not removed, the dielectric liners 71 can beincorporated into the dummy gate structures 173.

The dummy gate structure 173 is formed directly on the top surface ofthe shallow trench isolation layer 20, and can contact widthwisesidewalls of the semiconductor fins (3S, 3D, 3B). In one embodiment, thedummy gate structures 173 can include a dielectric material portionincluding a different material than the replacement gate dielectrics 70.In one embodiment, each dummy gate structure 173 can consist of thedielectric material portion having a same composition throughout. If thedielectric liners 71 are not removed, each dummy gate structure 173 caninclude a dielectric liner having a same composition than the gatedielectrics 70, and an insulator material portion contacting innersidewalls of dummy gate spacers 59.

If the second exemplary semiconductor structure is derived from thefirst exemplary semiconductor structure of FIGS. 11A-11E, the processingsteps of FIGS. 12A-12E can be subsequently performed.

Referring to FIGS. 13A-13E, a third exemplary semiconductor structureaccording to a third embodiment of the present disclosure can be derivedfrom the first exemplary structure of FIGS. 9A-9E by forming a masklayer 90 to mask the dummy gate structures (51, 53) and by removing thegate structures (50, 52). In this embodiment, the gate structures (50,52) are non-functional gate structures, and the dummy gate structures(51, 53) remain in a packaged semiconductor chip as a permanentstructure.

The mask layer 90 can be a soft mask layer including an organic material(such as a photoresist layer), or can be a hard mask layer including adielectric material such as silicon nitride, silicon oxide, a dielectricmetal oxide layer, or a dielectric metal nitride layer. The etchchemistry for removal of the dummy gate structures (51, 53) can beselective to the dielectric material of the gate spacers 56 and thesemiconductor material of the semiconductor fins (3S, 3D, 3B).

Referring to FIGS. 14A-14E, replacement gate structures (70, 72) areformed in the gate cavities from which the gate structures (50, 52) areremoved. Formation of the replacement gate structures (70, 72) and thedummy replacement gate structures (71, 73) can be formed by depositing agate dielectric layer and a conductive material layer, and removingexcess portions of the gate dielectric layer and the conductive materiallayer from above the top surface of the planarization dielectric layer80 by a planarization process, which can be, for example, a chemicalmechanical planarization (CMP) process. In one embodiment, the masklayer 90 can be removed during the planarization process.

Each remaining portion of the gate dielectric layer filling the gatecavities constitutes a gate dielectric, which is herein referred to as areplacement gate dielectric 70. Each remaining portion of the conductivematerial layer filling the gate cavities constitutes a gate electrode72. Each replacement gate structure (70, 72) is a functional gatestructure that straddles at least one semiconductor fin 30 and at leastone trench capacitor (12, 42, 44). Each replacement gate structure (70,72) includes a replacement gate dielectric 70 and a gate electrode 72.The dummy gate structures (51, 53) are non-functional gate structures,and extends along the same direction as the replacement gate structures(70, 72), i.e., along the general direction perpendicular to thelengthwise direction of the semiconductor fins (3S, 3D, 3B).

In one embodiment, the material of the replacement gate dielectrics 70can be different from the material of the gate dielectrics 50. In thiscase, each dummy gate structure (51, 53) includes a dielectric liner(i.e., a dummy gate dielectric 51) containing a different material thanthe replacement gate dielectrics 70, which are the gate dielectrics offunctional gate structures.

The dummy gate fill structures 53 can include a dielectric material or aconductive material. If the dummy gate fill structures 53 include adielectric material, the dummy gate fill structures 53 are insulatormaterial portions. If the dummy gate fill structures 53 include aconductive material, the dummy gate fill structures 53 can include adifferent conductive material than the gate electrode 72.

Referring to FIGS. 15A and 15B, a variation of the first exemplarysemiconductor structure according to the first embodiment of the presentdisclosure can be derived from the first exemplary semiconductorstructure by forming narrower dummy gate structures (51, 53) at theprocessing steps of FIG. 7A-7E. Correspondingly, the replacement dummygate structures (71, 73) are narrower than the counterparts illustratedin FIGS. 10A-10E. In this case, the replacement dummy gate structures(71, 73) contact the shallow trench isolation layer 20, and does notcontact the widthwise sidewalls of the semiconductor fins (3S, 3D, 3B).The dummy gate spacers 59 contact the widthwise sidewalls of thesemiconductor fins (3S, 3D, 3B).

Referring to FIGS. 16A and 16B, a variation of the first exemplarysemiconductor structure according to the second embodiment of thepresent disclosure can be derived from the variation of the firstexemplary semiconductor structure illustrated in FIGS. 15A and 15B byperforming the processing steps of FIGS. 12A-12E. The dummy gatestructures 173 in FIGS. 16A and 16B are narrower than the counterpartsillustrated in FIGS. 12A-12E. In this case, the dummy gate structures173 contact the shallow trench isolation layer 20, and does not contactthe widthwise sidewalls of the semiconductor fins (3S, 3D, 3B). Thedummy gate spacers 59 contact the widthwise sidewalls of thesemiconductor fins (3S, 3D, 3B).

Referring to FIGS. 17A and 17B, a variation of the third exemplarysemiconductor structure according to the first embodiment of the presentdisclosure can be derived from the third exemplary semiconductorstructure by forming narrower dummy gate structures (51, 53) at theprocessing steps of FIG. 7A-7E. In this case, the dummy gate structures(51, 53) contact the shallow trench isolation layer 20, and does notcontact the widthwise sidewalls of the semiconductor fins (3S, 3D, 3B).The dummy gate spacers 59 contact the widthwise sidewalls of thesemiconductor fins (3S, 3D, 3B).

The various embodiments of the present disclosure employ dummy gatestructures to confine the growth of raised source regions along thelengthwise direction of the semiconductor fins, thereby preventingelectrical short between neighboring pairs of raised source regions.Further, conductive strap structures that provide electrical contactbetween the inner electrodes of trench capacitors and the source regionscan be formed as self-aligned structures laterally confined between anouter sidewall of a gate spacer and an outer sidewall of a dummy gatespacer, thereby preventing electrical shorts between a neighboring pairof conductive strap structures.

While the disclosure has been described in terms of specificembodiments, it is evident in view of the foregoing description thatnumerous alternatives, modifications and variations will be apparent tothose skilled in the art. Each of the embodiments described herein canbe implemented individually or in combination with any other embodimentunless expressly stated otherwise or clearly incompatible. Accordingly,the disclosure is intended to encompass all such alternatives,modifications and variations which fall within the scope and spirit ofthe disclosure and the following claims.

What is claimed is:
 1. A semiconductor structure comprising:semiconductor fins located on a substrate, wherein each of saidsemiconductor fins is laterally bound by a pair of lengthwise sidewallsand a pair of widthwise sidewalls; trench capacitors located within saidsubstrate, wherein an inner electrode of each trench capacitor iselectrically shorted to a source region in one of said semiconductorfins; a gate structure straddling one of said semiconductor fins, saidgate structure comprising a stack of a gate dielectric and a gateelectrode; a gate spacer laterally surrounding said gate dielectric andsaid gate electrode; and a dummy gate structure including dielectricsurfaces located between a widthwise sidewall of one of saidsemiconductor fins and a widthwise sidewall of another of saidsemiconductor fins and laterally extending along a same direction assaid gate structure.
 2. The semiconductor structure of claim 1, furthercomprising a dummy gate spacer laterally surrounding said dummy gatestructure.
 3. The semiconductor structure of claim 2, wherein said dummygate spacer has a same composition and a same lateral thickness as saidgate spacer.
 4. The semiconductor structure of claim 2, wherein saiddummy gate structure comprises: a dielectric liner having a samethickness and a same composition as said gate dielectric; and aconductive material portion having a same composition as said gateelectrode and embedded within said dielectric liner.
 5. Thesemiconductor structure of claim 2, wherein said dummy gate structurecomprises a dielectric material portion including a different materialthan said gate dielectric.
 6. The semiconductor structure of claim 5,wherein said dummy gate structure consists of said dielectric materialportion.
 7. The semiconductor structure of claim 5, wherein said dummygate structure comprises: a dielectric liner having a differentcomposition than said gate dielectric; and an insulator material portioncontacting inner sidewalls of said dummy gate spacer.
 8. Thesemiconductor structure of claim 2, further comprising: a source regionlocated within said one of said semiconductor fins and contacting saiddummy gate structure; and a raised source region contacting sidewallsand a top surface of said source region and a sidewall of said gatespacer and a sidewall of said dummy gate spacer.
 9. The semiconductorstructure of claim 2, further comprising a conductive strap structureelectrically shorting a source region in said one of said semiconductorfins and an inner electrode in one of said trench capacitors andcontacting said dummy gate spacer.
 10. The semiconductor structure ofclaim 1, further comprising a shallow trench isolation layer in contactwith a bottom surface of said dummy gate structure.
 11. A method offorming a semiconductor structure comprising: forming semiconductor finson a substrate, wherein each of said semiconductor fins is laterallybound by a pair of lengthwise sidewalls and a pair of widthwisesidewalls; forming trench capacitors within said substrate, forming agate structure straddling one of said semiconductor fins, said gatestructure comprising a gate dielectric and a gate electrode contactingsaid gate dielectric; forming a dummy gate structure between two of saidsemiconductor fins, wherein said dummy gate structure laterally extendsalong a same direction as said gate structure.
 12. The method of claim11, wherein dielectric surfaces of said dummy gate structure contact awidthwise sidewall of one of said semiconductor fins and a widthwisesidewall of another of said semiconductor fins.
 13. The method of claim11, further comprising simultaneously forming a gate spacer and dummygate spacer, wherein said gate spacer laterally surrounds said gatestructure and said dummy gate spacer laterally surrounds said dummy gatestructure.
 14. The method of claim 13, wherein said dummy gate spacercontacts a widthwise sidewall of one of said semiconductor fins and awidthwise sidewall of another of said semiconductor fins.
 15. The methodof claim 11, further comprising: forming a disposable gate structurestraddling said one of said semiconductor fins prior to forming saidgate structure, said disposable gate structure comprising at least onedisposable gate material; and replacing said at least one disposablegate material portion with said gate dielectric and said gate electrode,whereby said gate structure is formed.
 16. The method of claim 15,further comprising: forming a disposable dummy gate structure betweensaid two of said semiconductor fins concurrently with formation of saiddisposable gate structure; and replacing said disposable dummy gatestructure with said dummy gate structure.
 17. The method of claim 15,further comprising: forming a gate spacer around said disposable gatestructure; and forming a dummy gate spacer around said disposable dummygate structure concurrently with formation of said gate spacer.
 18. Themethod of claim 15, wherein said dummy gate structure comprises: adielectric liner having a same thickness and a same composition as saidgate dielectric; and a conductive material portion having a samecomposition as said gate electrode and embedded within said dielectricliner.
 19. The method of claim 18, further comprising replacing saiddielectric liner and said conductive material portion with a dielectricmaterial portion.
 20. The method of claim 18, further comprising forminga shallow trench isolation layer laterally surrounding saidsemiconductor fins, wherein dummy gate structure is formed prior to, orafter, formation of said gate structure, directly on a top surface ofsaid shallow trench isolation layer.